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Configuration
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Technical Specifications
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| Type | Rated Power (W) | Resistance Range |
Dimensions (mm)
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25°C
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70°C
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Min. | Max. |
L
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Lead Dia.
±.02 |
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| RX90-2.5 | 2.5 | 1.2 | R10 | 1K | 20 ± 1.0 | 0.8 |
| RX90-3 | 3.0 | 1.5 | R15 | 1K5 | 25 ± 1.0 | 0.8 |
| RX90-4.5 | 4..5 | 2.5 | R33 | 3K3 | 38 ± 1.0 | 0.8 |
| RX90-3.5 | 3.5 | 2.5 | R15 | 1K5 | 25 ± 1.0 | 0.8 |
| RX90-5 | 5.0 | 3.0 | R33 | 3K3 | 38 ± 1.0 | 0.8 |
| RX90-7 | 7.0 | 4.0 | R51 | 4K7 | 50 ± 1.0 | 0.8 |
| RX90-11 | 11.0 | 6.0 | R91 | 8K2 | 75 ± 1.0 | 0.8 |
| Characteristics | |
| Test Condition | Specifications |
| Tolerances | ± 5% (J) ± 10% (K) |
| Temperature Coefficient | (-80 ~ + 500) x 10-6/°C |
| Max. cont. working voltage |  |
| Insulation Voltage | 2000V |
| Insulation Resistance | > 104 M  |
| Climate category | 55 / 150 / 56 |
| Temperature range | - 55 ~ 150°C |
| Power derating | Ref. Fig. 1 Solder Joint Temperature |
| Failure rate | 100 10-9 h-1 / 100 x 10 -9h-1 |
| Load life: P70, 70 °C, 1000 hrs |  R < ± 5% R |
| Damp heat, steady state 40 °C, 93%, r.h. 56 days | R < ± 5% R |
| Climate sequence | R < ± 5% R |
| Terminal tensile strength | R < ± 1% R |
| Anti-pull strength | 50N |
| Solder heat resistance 260°C | R < ± 1% R |
| Solderability | IEC68- 2 - 20T |
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Fig. 1 Solder Joint Temperature
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Temperature at solder joint should never exceed 150°C under normal working conditions. Solder joint temperature is defined as sum of ambient temperatue and temperature rise caused by applied load. After fusing, the fusable solder joint can be repaired with regular solder 60 / 40 SN / pb |
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Fig. 2 Fusing vs Load
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use R for decimal. >100| home page | product gude | TO ORDER PRODUCTS |
| E mail: microohm@mail.com | ||
| Call Toll Free: 1-800-845-5167 |