| PERFORMANCE SPECIFICATIONS: |
| Temperature Coefficient |
< 200 : ±400PPM/°C; > 20: 350PPM/°C |
| Short-time Overload |
 R/R < ±(5%+0.05), with no evidence of mechanical damage |
| Dielectric Withstanding Overload |
No evidence of flashover, mechanical damage, archng or insulation breakdown |
| Terminal Strength |
No evidence of mechanical damage. |
| Resistance to Soldering Heat |
R/R < ±(1%+0.05), with no evidence of mechanical damage |
| Solderability |
Min. 95% coverage. |
| Temperature cycling |
R/R < ±(2%+0.05), with no evidence of mechanical damage |
| Humidity (Steady State) |
R/R < ±(5%+0.05), with no evidence of mechanical damage |
| Load Life in Humidity |
For Wire wound range, the R/R is ±5%
For Power film range, the <100K , the R/R is ±5%
For Power film range, the >100K, the R/R is ±10%
|
| Load Life |
For Wire wound range, the R/R is ±5%
For Power film range, the <100K , the R/R is ±5%
For Power film range, the >100K, the R/R is ±10%
|
